The difference is that the uncoupler is a standard model and is divided into several fixed models according to the wafer specification of 6", 8" and 12", while the UV curing oven is basically a custom made model with many specifications.
Difference two, the light way is not the same
UV uncoupling machine standard uncoupling light source is generally bottom-up, UV light source at the bottom of the light.
UV curing ovens are not at the bottom, most of the light in the upper part of the light.
Difference three, the use is not the same
UV decoupling machine is usually decoupling UV film, not curing with the UV film tape has a very strong viscosity, in the wafer grinding process or wafer cutting process during the tape firmly stick to the wafer. When irradiated with UV light, the bond strength can be reduced and thus the tape can be unglued.
UV ovens and UV curing ovens are used for curing purposes. UV curing means ultraviolet curing, UV is the abbreviation for ultraviolet light, curing refers to the process of polymerisation of substances from low molecules into high molecules. UV curing generally refers to the curing conditions or requirements for coatings (paints), adhesives (glues), inks or other potting sealants that need to be cured with UV light, which distinguishes them from natural curing, heating curing, and gluing agent (curing agent) curing, etc.
One separates the wafer semiconductor material from the adhesive material and the other hardens the two materials by making them bond. A contradictory and different interpretation.
UV decoupling machine application areas: integrated circuit board, LED, wafers, IC, mobile hard disk, semiconductor wafers and other semiconductor materials, glass filters and other UV film decoupling, UV tape decoupling use.
